590.362-022 - MICROELECTRONICS TECHNICIAN (electron. comp.) - DOT Dictionary of Occupational Titles Job Description

CODE: 590.362-022

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TITLE(s): MICROELECTRONICS TECHNICIAN (electron. comp.)

Operates variety of semiconductor processing, testing, and assembly equipment to assist engineering staff in development and fabrication of prototype, custom-designed, electronic circuitry chips in research laboratory, using knowledge of microelectronic processing equipment, procedures, and specifications: Operates equipment to convert integrated circuit layout designs into working photo masks; clean, coat, bake, align, expose, develop, and cure photoresist on wafers; grow layers of dielectric, metal, and semiconductor material on masked areas of wafers; clean, etch, or remove materials on areas not covered by photoresist; and implant chemicals to selective areas of wafer substrate to alter substrate electrical characteristics. Operates various test equipment to verify product conformance to processing and company specifications. Operates equipment to assemble, dice, clean, mount, bond, and package integrated circuit devices. May perform some assembly and packaging operations manually. May assist in interpretation and evaluation of processing data and in preparation of related reports. May assist in technical writing of semiconductor processing specifications.
GOE: 06.01.03 STRENGTH: L GED: R4 M4 L3 SVP: 6 DLU: 86
ONET CROSSWALK: 92902C Electronic Semiconductor Test and Development Technicians

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CODE: 590.362-022 Buy the DOT: Download
TITLE(s): MICROELECTRONICS TECHNICIAN (electron. comp.)

Operates variety of semiconductor processing, testing, and assembly equipment to assist engineering staff in development and fabrication of prototype, custom-designed, electronic circuitry chips in research laboratory, using knowledge of microelectronic processing equipment, procedures, and specifications: Operates equipment to convert integrated circuit layout designs into working photo masks; clean, coat, bake, align, expose, develop, and cure photoresist on wafers; grow layers of dielectric, metal, and semiconductor material on masked areas of wafers; clean, etch, or remove materials on areas not covered by photoresist; and implant chemicals to selective areas of wafer substrate to alter substrate electrical characteristics. Operates various test equipment to verify product conformance to processing and company specifications. Operates equipment to assemble, dice, clean, mount, bond, and package integrated circuit devices. May perform some assembly and packaging operations manually. May assist in interpretation and evaluation of processing data and in preparation of related reports. May assist in technical writing of semiconductor processing specifications.
GOE: 06.01.03 STRENGTH: L GED: R4 M4 L3 SVP: 6 DLU: 86
ONET CROSSWALK: 92902C Electronic Semiconductor Test and Development Technicians